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Twelve contract factories: earnings grew in both cohorts. The multiple moved in only one

Pranav Yadav · · 8 min read

Twelve companies, four plates. The first plate sorts them, the second shows what their prices did this year, the third draws the chain they all sit in, and the fourth shows which way each one is walking. The numbers come from the twelve company pages on this portal, read on 9 October, and from the deep-tracks that rebuilt nine of them over the last week.

The thing to hold on to: these companies all do roughly the same job, and the market spent 2026 treating half of them very differently from the other half.

Plate 01 — What EMS is, and who does it · two cohortsprice upsidewaysdown
EMS

Electronics Manufacturing Services

The contract factory: a brand designs the product, an EMS firm builds it.

  1. Chips & partsbought in
  2. Circuit boardsolder chips onto it
  3. Box buildboard → finished unit
  4. Brandputs its name on it

EMS does these two

AC / consumer makers

Build consumer products — ACs, phones, TVs, appliances — for brands. High volume, 4–10% margin, seasonal, Indian customers.

  • DIXONDixon Technologiesprice up
  • AMBERAmber Enterprisesdown
  • PGELPG Electroplastdown
  • EPACKEPACK Durabledown
  • VOEPLVirtuoso Optoelectronicsprice up

Specialists

Low-volume, high-mix work for industrial, aerospace, defence, medical and semicap customers. 10–20% margin, export-heavy, order-book driven.

  • SYRMASyrma SGSprice up
  • KAYNESKaynes Technologysideways
  • AVALONAvalon Technologiesprice up
  • CYIENTDLMCyient DLMprice up
  • CENTUMCentum Electronicsprice up
  • VINYASVinyas Innovativeprice up
  • AIMTRONAimtron Technologiesprice up

1. One job, two cohorts

An electronics manufacturing services company is a contract factory. A brand designs a product; the EMS firm solders chips onto a board, puts the board in a box, tests it and ships it. The brand puts its name on it. Of the four steps on the strip above, EMS does the two in the middle.

The twelve names here split cleanly by who the brand is.

The AC makers build for Indian brands, in volume

Dixon, Amber, PG Electroplast, EPACK and Virtuoso build phones, TVs and room ACs for Voltas, Samsung and the rest. Thin margins (FY26 operating margins of 4–10%), seasonal, Indian customers, and the profit becomes cash: over five years the cohort produced ₹1.51 of operating cash for every rupee of profit. Dixon earns 3.8% on sales and still returns 29% on capital, because its inventory turns in a month.

The specialists build for industrial and defence customers, in small runs

Syrma, Kaynes, Avalon, Cyient DLM, Centum, Vinyas and Aimtron build boards and boxes for aerospace, defence, medical, industrial and semiconductor-equipment customers, much of it exported. Fatter margins (10–20%), order-book driven, and the profit has not become cash yet: the cohort's five-year operating cash is −0.18 of its profit. Receivables sit at 130 days against the AC makers' 60. Kaynes is the extreme, with ₹977 Cr of profit over five years against −₹615 Cr of operating cash.

Both cohorts have met about half of the financial guides they have closed (30 of 59 for the AC makers, 34 of 65 for the specialists). The AC makers slip dates more; the specialists keep their margins less.

Plate 02 — Two cohorts, one multiple moved · price × = EPS × · P/E × EPS P/E split n/alog scale

Earnings grew in both cohorts. The multiple moved in only one.

AC makers · 4 names1.04×average · median 0.81×

Earnings up a little; the multiple did not move.

2×1×EPS 1.12P/E 1.03
Specialists · 6 names2.53×average · median 2.59×

Earnings up a little more — and the multiple nearly doubled.

2×1×EPS 1.29P/E 1.89
By company
0.5×1×2×3×
  • Specialistsfive up since Jan–Apr 2026; two moved earlier
  • CYIENTDLM3.4×
  • AVALON2.9×
  • SYRMA2.6×
  • AIMTRON2.5×
  • VINYAS1.8×
  • KAYNES1.1×
  • CENTUM3.5×
  • AC / consumer makersmixed
  • DIXON1.3×
  • VOEPL1.9×
  • AMBER0.7×
  • PGEL0.8×
  • EPACK0.4×
Log scale, so the teal and amber segments add up to the price move. Left of 1× is a fall. Hatched: a loss year at one end makes the split meaningless. Cohort averages are over the names with a split (4 AC makers, 6 specialists).

2. Same multiple, reached two different ways

Both cohorts trade at about the same price for a rupee of earnings: a median P/E of 84 for the AC makers and 85 for the specialists. And both prices ask for about 25 points more growth a year than our base cases. On the multiple alone, the market makes no distinction.

It made one on the way there. Every price move on the plate is split exactly as earnings times multiple, so the teal and amber segments add up to the bar.

The specialists are 2.5x since January, and the P/E did most of it

Six of the seven specialists are in an up-phase that began between January and April 2026. The cohort's price is 2.53x on average: earnings 1.29x, multiple 1.89x. Cyient DLM is the purest case, 3.4x on earnings that did not move (0.98x) and a multiple that went 3.5x. Vinyas is the one name where earnings led. Kaynes is the exception the other way: its multiple halved between November and June, after its plant dates slipped and a broker questioned its accounts, and it has gone sideways since.

The AC makers sat it out

The AC cohort is 1.04x on average, 0.81x at the median. Dixon is up only as far as its earnings grew (multiple flat at 0.96x). Amber and PG Electroplast are falling; EPACK has lost 57% since September 2025. The cohort with the better cash record saw no change in its multiple at all.

So the sector's multiple did not move. A story's did. The higher multiple went to the names with a defence, export or semiconductor label, and the next two plates are about what that label means.

Plate 03 — The chain · six layers, two actslisted in Indiaglobal / unlisted

The money is in making the chip. Using it — where every Indian EMS name lives — is the thin end. Each new plant in Plate 04 is a move away from, or deeper into, those two green boxes.

  1. Making the chipRich
    Chip designdraw the circuit25–35%
    QualcommApple
  2. Making the chipRich
    Wafer fabprint it on silicon35–55%no Indian fab
    TSMCTata Dholera (building)
  3. Making the chipAdequate
    Packaging & testcut, seal, test (OSAT)15–25%
    Tata AssamMicronKaynes Sanand · Q3 FY27
  4. Using the chipThin
    Circuit boardsolder chips onto a board4–12%all EMS
    DixonKaynesSyrmaVinyasCyient DLMCentum
  5. Using the chipThin
    Box buildboard → finished unit5–10%
    AvalonAimtronSyrmaDixon
  6. Using the chipAdequate
    Brand / systemyour phone, AC, radar10–20%
    VoltasSiemensApple
  7. Feeds the fab & plant
    Chemicals18–28%ultra-pure chemicals used to print chipsAcutaas ~1%Aether trials
    Equipment & parts10–15%the machines that make chips — one customer eachAvalonCentumCyient DLMSansera
    Plant infrastructure15–22%power, gases, cryogenicsINOX IndiaSchneider
Margins per layer are typical industry ranges, not from the filings. The two green boxes are where every Indian EMS name in this piece earns its money; their 4–20% is the cohort’s own FY26 operating margins. Supplier names come from each company’s filings and are one customer or about 1% of sales in every case.

3. Where the money is in the chain

The strip in Plate 01 was four steps. Stretched out, it is six, and the margins are not evenly spread along it.

Making the chip is rich; using it is thin

Designing a chip and printing it on silicon carry the fat margins, and no Indian listed company does either. Packaging and testing the chip is the middle layer. Soldering packaged chips onto a board and building the board into a box, the two green boxes, is where every Indian EMS name in this piece earns its money, at 4–12% and 5–10%. The margin ranges per layer are typical industry figures, not from any filing; the two green boxes carry the cohort's own numbers.

The "semiconductor" names are mostly suppliers to the fab

Under the chip-making layers sit the companies that feed them: chemicals, equipment and parts, plant infrastructure. This is where most of the listed semiconductor story lives, and in every case it is one customer or about 1% of sales. Avalon, Centum and Cyient DLM each build parts for a single chip-equipment customer. Acutaas's chip chemicals are about 1% of revenue. Kaynes is the only EMS name that touches the chip itself, with a packaging plant at Sanand that expects to start billing in Q3 FY27.

Plate 04 — Which way each is moving earns today new plant promised

Two names go backward into the chip side, three go forward toward the system, two stay put and add capacity. Only KAYNES touches the chip itself — and it has slipped five times.

  1. KAYNES₹21,922 Cr · P/E 631.1× · EPS 1.0 · P/E 1.1
    DesignFabPackageBoardBoxSystem
    Design: nothing
    Fab: nothing
    OSAT
    49%
    22%
    System: nothing

    Upstream, two layers. The only chip move.

    OSAT packaging at Sanand, ₹3,200 Cr. Delayed five times — FY25-end → Q4 FY26 → Apr → Jul 2026 → Q3 FY27; nothing billed by June. Also exiting meter installation, a forward step it regretted.

  2. SYRMA₹33,433 Cr · P/E 912.6× · EPS 1.5 · P/E 1.7
    DesignFabPackageBoardBoxSystem
    Design: nothing
    Fab: nothing
    Package: nothing
    PCBA
    ↑ bare PCB
    ODM
    System: nothing

    Upstream, into its own input: the bare PCB.

    A bare-board plant in Andhra Pradesh, ₹1,500–1,600 Cr by FY30 (phase 1 ₹800 Cr), Elemaster and Kaga JVs. Trial production Q3 FY27, commercial Q4 FY27/Q1 FY28. ODM to 25% is a forward move by mix.

  3. AIMTRON₹3,720 Cr · P/E 852.5× · EPS 1.3 · P/E 1.9
    DesignFabPackageBoardBoxSystem
    Design: nothing
    Fab: nothing
    Package: nothing
    29%
    69% +
    System: nothing

    Same layer, more of it.

    Mechatronics greenfield — 6 SMT lines, +₹500 Cr capacity — plus the acquired US plant (AIC). Greenfield funded, first line delayed; AIC at 54% utilisation / 11% margin, target 90% / 20%+. A small step into cable assembly and components later.

  4. AVALON₹15,385 Cr · P/E 1152.9× · EPS 1.5 · P/E 1.9
    DesignFabPackageBoardBoxSystem
    Design: nothing
    Fab: nothing
    Package: nothing
    PCBA
    ~60%
    System: nothing

    Same layer, on purpose — sideways into new markets.

    Refused a PCB/component plant despite incentives. Large Chennai land parcel for modular complex box builds; new end-markets in semicap, defence and data-centre racks. No size or cost announced; US breakeven pushed to late FY27.

  5. VINYAS₹1,818 Cr · P/E 601.8× · EPS 1.5 · P/E 1.2
    DesignFabPackageBoardBoxSystem
    Design: nothing
    Fab: nothing
    Package: nothing
    Boards
    Def. 79%
    Subsystem

    Up the chain, one step: boards → the sub-system the board sits in.

    SMT doubling at Mysuru plus a 25,000 sq ft Class 3 integration facility — harnesses, assemblies, tested sub-systems for the same defence customers. Capex nearly done, capacity due Q2 FY27; system orders ₹247 → 324 Cr in ten months.

  6. CENTUM₹6,087 Cr · P/E 703.5× · split n/a
    DesignFabPackageBoardBoxSystem
    Design: nothing
    Fab: nothing
    Package: nothing
    EMS 72%
    BTS 28%
    System

    Up the chain, furthest along: sub-systems it designs → whole systems.

    KIADB Aerospace Park integration facility for full radars, naval navigation, satellite payloads; ₹50–70 Cr fit-out from late FY28. FY27 capex ₹40–45 Cr, half on BTS R&D; ~₹520 Cr booked of a ₹2,000 Cr FY28 goal. EMS funds the working capital.

  7. CYIENTDLM₹7,740 Cr · P/E 953.4× · EPS 1.0 · P/E 3.5
    DesignFabPackageBoardBoxSystem
    Design: nothing
    Fab: nothing
    Package: nothing
    B2P
    B2S 6%
    FY28+

    Up the chain, slowest: fill the plants, then own the design.

    No new capacity at 50–60% utilisation; Mysore land bought for an own factory. B2S volume from FY28, AI data-centre and robotics ‘order intake this year, revenue later’. Margin 11–13% by FY29, 13–18% from FY30 — a three-phase plan, none of it billed yet.

Market caps and P/E from the Valuation Check rows priced 7–9 Oct 2026; the price line is the current phase on the Price journey card. Segment shares are FY26 from the Business tab. Plant dates are the companies’ own, from the guidance ledgers.

4. Which way each specialist is moving

Every one of the seven specialists is building or filling a plant, and every one has a slide about moving to a higher-margin layer. They are not all moving in the same direction.

Two go backward, into the component

Syrma is building a bare-PCB plant in Andhra Pradesh, ₹1,500–1,600 Cr by FY30, with trial production due in Q3 FY27: the layer it currently buys from. Kaynes is going two layers back, into chip packaging and HDI boards, about ₹4,600 Cr of capex across the two. Its plant dates have moved five times, from FY25-end to Q3 FY27, and neither plant had billed by June 2026. These are the two largest companies in the cohort, and the two with the longest delays.

Three go forward, toward the system

Vinyas, Centum and Cyient DLM are moving the other way: from the board to the sub-system or system the board sits in, which they design. Vinyas has a 25,000 sq ft integration facility nearly built and its system orders went from ₹247 Cr to ₹324 Cr in ten months. Centum is furthest along, designing whole radars and satellite payloads, with about ₹520 Cr booked toward a ₹2,000 Cr FY28 goal. Cyient DLM is slowest: its design-led work was 6–7% of FY26 revenue, volume is promised for FY28, and the margin step to 11–13% is dated FY29. These are the three smallest companies here.

Two stay put and add capacity

Aimtron is filling a six-line greenfield and a US plant it bought, at the same layer. Avalon said no, out loud, to a component plant with incentive money on the table, and is instead taking its box-build model into new end-markets. Its new Chennai land has no size or cost attached yet.

One pattern across all seven: the plant comes first and the mix comes second. The design-led revenue is guided for FY28 almost everywhere, and almost nobody guides the FY27 margin up. Vinyas guides 11–12% against 12.5% delivered; Syrma 10.5–11% against 11.3%. The multiple in Plate 02 arrived before the margin in Plate 04.

What would make me wrong

  • The cash gap is partly construction. A company growing 30–50% a year ties up cash in receivables and inventory by design; the specialists' negative operating cash says "not collected yet", not "never collected". If their order books convert on schedule, the cohort's cash record flips.
  • The AC makers' flat multiple may be the market pricing a real problem: FY26 was a lost AC season (EPACK's revenue fell 12.7%, PG Electroplast missed its own guide by a fifth), and a cohort that lives on one Indian summer may carry a different multiple from one that lives on global defence budgets.
  • The "same multiple" line hides a difference in what the P/E is on. Dixon's trailing profit carries fair-value gains on a stake, so its 41x understates it; Centum's loss years make its multiple hard to read at all.
  • Plate 03's layer margins are typical industry ranges, and the actual spread between an Indian packaging plant and an Indian board plant may be narrower than the chart implies once incentives and utilisation are in.

The opposite error is to read the specialists' higher multiple as proof the move up the chain has already worked. On the filings, none of it has billed.

The seven specialists appear on this portal with every section rebuilt from their own filings; the one earlier story is Aimtron's bridge. Twelve factories, one job, and the market paid up for the seven that have a reason to be somewhere else in the chain by FY28. The plants exist. The mix does not, yet.

This is a summary of what twelve companies' filings, earnings calls and investor decks say. It is not investment advice or research.

Twelve contract factories: earnings grew in both cohorts. The multiple moved in only one – Story of a Stock